View
| µRaman / µPL | | Horiba Jobin Yvon | LABRam | CMNF - Croissance et caractérisations avancées |
View
| 3D printer | | CKAB | MakerBot Replicator 2X 3D | CMNF - Intégration |
View
| AFM Bioscope | Bioscope Bruker
Sample size: 10 centimeter diameter
Scan range: 100µm x100µm, Z range: 6µm
Lateral resolution: nanometric, Vertical resolution: 70pm
Working mode:In situ Electrodeposition AFM, TERS
Environment: Ambient air, Nitrogen gas and Liquid
Temperature working range: 300K
Term of use; Free Access
| Veeco | Bioscope | PCP - Domaine AIR |
View
| AFM Dimension | Dimension 3100 Bruker
Sample size: 20 centimeter diameter
Scan range: 100µm x 100µm, Z range :6µm
Lateral Resolution: nanometric, Vert resolution :50pm
Working mode ; EFM, KPFM, CAFM, PFM, Force spectroscopy, SCM, SGM
Environment: Ambient air, Nitrogen gas and Liquid
Temperature working range: 300K
Term of use: Free Access
| Veeco | Dimension 3100 | PCP - Domaine AIR |
View
| AFM Edge | equipement sur BCM depuis le 15 novembre 2021
| Brüker | Edge | CMNF - Caractérisation In-Line |
View
| AFM Icon | Dimension ICON Bruker
-----------------------------------------------------------
Note: problem laser -- do not scan more than 20 x 20 µm² including offsets
Do not use z sensor as topographical information
Horizontal deflection blocked
---------------------------------------------------
Sample size: 20 centimeter diameter
Scan range: 100µm x 100µm, Z range :10µm
X and Y piezo linearization Feedback (close loop)
Lateral resolution: nanometric, Vertical resolution : 30pm
Working mode ; AFM Tapping, AFM Peakforce, EFM, KPFM, CAFM, PeakForce TUNA, PFM, SThM, Force spectroscopy, SCM, SGM
Environment: Ambient air, Nitrogen gas and Liquid
Temperature working range: -25°C-150°C
Term of use: Free Access
| Bruker | Icon | PCP - Domaine AIR |
View
| AFM Multimode | Multimode Picoforce Bruker
Sample size: 1 centimeter square
Scan range: 10µm x 10 µm Z range: 2.5µm
Resolution: atomic, nanometric, low noise, Vert resolution: 30pm
Working mode: EFM w/2w, KPFM, CAFM, PFM, Force spectroscopy, CFM, STM
Environment: Ambient air, Nitrogen gas
Temperature working range: 300K
Term of use: Free Access
| Veeco | Multimode | PCP - Domaine AIR |
View
| AFM SMART | | Brucker | A définir | CARAC - DC/BF/MEMS |
View
| AFM/SEM | | IEMN | AFM/SEM | PCP - Domaine AIR |
View
| ALD PICO1_oxynit | sur badgeuse BCM depuis 24 fevrier 2023
| PICOSUN | R200 Advanced | CMNF - Dépôts chimiques |
View
| ALD PICO2_autres | We can deposit the following materials : Pt
| PICOSUN | R200-Adv | CMNF - Dépôts chimiques |
View
| ALD PICO2_oxynit | | PICOSUN | R200-Adv | CMNF - Dépôts chimiques |
View
| Autoclave | Autoclave à couvercle amovible à fermeture rapide (ACAFR) permettant la stérilisation d’ustensiles et dispositifs, ainsi que l’inactivation des déchets biologiques sous forme liquides et solides.
Note : seules les personnes habilitées à manipuler les ACAFR peuvent lancer les cycles d’autoclave
Quick-Closing Removable Lid Autoclave (ACAFR) allowing sterilization of utensils and devices, as well as inactivation of biological waste in liquid and solid form.
Note: only people authorized to handle ACAFRs can start autoclave cycles
| Systec | n.a | Plate-forme L2 |
View
| B3 CVD empty | | Tempress | TS6303-4 | CMNF - Dépôts chimiques |
View
| Banc de photoconductivité | | IEMN | 1 | D1 - PHYSIQUE |
View
| Banc KEITHLEY 2 Pointes | sur badgeuse BCM depuis le 1er janvier 2021
| Keithley | 3631B | CMNF - Caractérisation In-Line |
View
| Banc KEITHLEY 4 Pointes | Mesures I-V,résistances, diodes,...
Equipement sur badgeuse BCM depuis le 01 janvier 2021
| keithley | 2612B | CMNF - Caractérisation In-Line |
View
| Banc NEMS | | non renseigné | non renseigné | CARAC - DC/BF/MEMS |
View
| Banc opto DC HF (2) | | Non renseigné | Non renseigné | CARAC Team |
View
| Banc photowathz | banc projet photowathz
- Paire de diodes lasers DFB
- Amplificateur Optique/chez BKTEL PHOTONICS
-Table optique/chez MICRO CONTROLE SPECTRA PHYSICS
| MICRO CONTROLE SPECTRA PHYSICS | Table optique | CARAC Team |
View
| Banc pulsé | | Keysight Technologies | à déf | CARAC - NonLinéaire |
View
| Bati5 (RIE) | Applications
The tool is capable of etching silicon nitrides, silicon oxides, polysilicon, tungsten, tungsten silicide and various polymers (BCB, PMMA, PEDOT).
Principal specifications
- RF (13.56 MHz) powered lower electrode (6 - 600 W)
- Available gases: Ar, N2, O2, SF6, CF4, CHF3
- Substrate temperature control
- 240 mm diameter table allowing for 200 mm (8”) batch capacity.
- Automatic RF matching network
- Control by PC using Oxford PC2000 software
- Endpoint detection through laser interferometry (JY Horiba hardware, in-house software “PlasmaScope”)
- Continuous process datalogging
Equipement sur badgeuse BCM depuis le 21 mai 2021
| OIPT, UK | PlasmaLab 80 Plus | CMNF - Gravure |
View
| Bati5 bis (RIE) | The tool is for etching thin (< 200 nm) layers of (poly)silicon, silicon nitrides and silicon oxides.
Other thin layers (e.g. graphene, graphene oxide, GaN) may also be etched if necessary.
The removal (ashing) of photoresist is not allowed ; use Bâti 5 or TEPLA (preferred).
Please follow the correct plasma cleaning procedure after etching (displayed beside the tool).
Equipement sur badgeuse BCM depuis le 21 mai 2021
| OIPT, UK | PlasmaLab 80 Plus | CMNF - Gravure |
View
| Bioimprimante 3D | 3D bioprinting is the utilization of 3D printing like techniques to combine cells, growth factors, and biomaterials to fabricate biomedical parts that maximally imitate natural tissue characteristics.
The 3D BioX from CellInk utilizes the layer-by-layer method to deposit bioinks to create tissue-like structures that are later used for biological research.
Features
-Temperature Controlled Printbed (4 C to 60 C)
-Compatible with standard petri dishes, multi wellplates, and custom inserts
-Compatible with a wide range of bioinks in CellInk library
-Clean chamber technology with UV-C germicidal lamps and HEPA H14 dual-filter system
-Exchangeable Photocuring Modules : 365 nm and 405 nm
https://www.cellink.com/product/cellink-bio-x/
| Cellink | BioX | Plate-forme L2 |
View
| Biolin Contact Angle | Surface wettability
Static or dynamic contact angle measurement
Surface energy
new contact angle measurements Biolin 2023
| Biolin Scientific | Theta Lite | CMNF - Caractérisation In-Line |
View
| Boite à gants chimie PlasLabs | | Plas Labs | 855 AC | D1 - NCM |
View
| Boite à gants évaporateur/chimie MBraun | | MBraun | MB-200B Modular Glove Box Workstation | D1 - NCM |
View
| BonderSB6 | install bcm juin 2022
The Bonder is a semi-automatic, computer-controlled, stand-alone substrate bonder equipped with a vacuum/pressure chamber and a loading arm. The machine processes aligned and unaligned wafers, substrates and chips. All bonding pair alignment is done on the BA6 tool , the substrate stacks are mechanically clamped using the transport fixture, and then transported and bonded in the SB6 chamber.
For aligned and unaligned wafers using thermo-compression, anodic, fusion, adhesive or any related bond technology.
Equipment Capabilities:
- Wafer size: pieces smaller than 2-inch, 2-inch up to 4-inch.
- Aligned bonding: Down to 3 μm depending on process conditions.
- Two ceramic heaters, Temperature up to 550°C
- The pressure inside the chamber is controlled via pumps: roughing, turbo pumps and valves.
- Max vacuum: 5e-5mbar in 5 minutes
- Bond Voltage; -500V to -600V for bond initiation and -800V to -1200V for anodic bonding.
- Maximum Peak Current: 15 mA.
- Tool Pressure up to 18 KN for 6-inch
- Motorized z-axis, pneumatic and simultaneous spacers and clamps movements
| SUSS MICROTEC | SB6e | CMNF - Lithographie |
View
| Caméra IR | | Quantum Focus Instruments | MWIR-512 | CARAC - NonLinéaire |
View
| Carbolite | | Carbolite | TZF 12/100/900 | CMNF - Thermique et Implantation |
View
| Cathodoluminescence | | Non renseigné | Non renseigné | CMNF - Caractérisation In-Line |
View
| Centrifuge | Centrifuge VWR, Mega Star 600R
| nc | nc | Plate-forme L2 |
View
| Cluster CT200 P1 | Equipement sur badgeuse BCM depuis le 7 avril 2021
| Alliance Concept | CT200 | CMNF - Dépôts physiques |
View
| Cluster CT200 P2 | Equipement sur badgeuse BCM epuis le 7 avril 2021
| Alliance Concept | CT200 | CMNF - Dépôts physiques |
View
| Cluster CT200 P3 | Equipement sur badgeuse BCM epuis le 7 avril 2021
| Alliance Concept | CT200 | CMNF - Dépôts physiques |
View
| CMP | Equipement sur BCM depuis le 1er aout 2024
| ALPSITEC | E460 | CMNF - Intégration |
View
| CNC fraiseuse numérique | CNC milling machine, DATRON NEO
Development of fluidics (devices) or mechanical compounds (molds) in polymer or hard materials
The DATRON neo is a CNC milling machine which enables the ultra-fast and efficient machining of different materials.
Whether for 3, 3 + 2 or 5 simultaneous, high precision or economical machining.
Compatible materials:
-composites
-aluminum
-light alloys
-wood
-plastics
-carbon fiber reinforced plastic
-stainless steel
-green ceramics
Machine capabilities:
-milling
-drilling
-3D engraving
The machine offer the highest level of precision and surface quality
Datron Machine Technology:
-Ultra-fast spindles up to 60,000 rpm.
-Quick installation thanks to DATRON clamping devices
-Flexible modular clamping solutions
-Minimal quantity cooling / lubrication circuit
-Automatic tool changer
-Patented technology for ultra-fast machining
-Quick and easy programming
-Microsoft Windows based control
-Optional automation solutions
-Very low consumption
| Datron | n.a | CMNF - Soft Litho |
View
| Confocal Andor | Confocal Microscopy
Capture superb confocal images at least 10 times faster than point scanner-based systems with the Andor Benchtop Confocal!
BC43 is a prime solution for 3D imaging of thick samples. A high sensitivity, high-speed imaging camera makes it perfect for live-cell confocal imaging.
A motorised XY stage allows multiple point acquisition, large organism montages and multipoint scanning resulting in outstanding productivity from a single imaging experiment.
Widefield Fluorescence Microscopy
Widefield imaging:
- Offers the gentlest illumination mode for samples that are super-sensitive to light
- Detects lower sample signals than in confocal mode
- Offers the fastest imaging speeds to capture dynamic processes in live cells
Use ClearView™ GPU to remove sample blur and enhance resolution, ensuring the best quality images.
Transmitted Light Microscopy
BC43 also delivers two different transmitted light options for amazing imaging flexibility:
- Use Brightfield Mode to visualise the development of larger organisms whose structures naturally deliver high contrast images
- For thinner samples and/or those with higher transparency, use Differential Phase Contrast (DPC) mode to draw out their structure
You can also mix and match modes like DPC and Widefield for even more imaging flexibility
Powerful and Intuitive Acquisition Software
At the heart of BC43 is a software that is not only feature-rich and flexible to your needs, it is easy-to-use as well:
- Imaris rendering engine – stunning real-time 3D images
- Clear and concise user-interface – acquire images in no time
- Multi-dimensional imaging protocols – advanced 3D time lapse or multi-position montage made easy
Comprehensive Image Analysis Software with AI Tools
BC43 comes with an introductory Imaris package, allowing users to:
- Visualise your 2D/3D/4D images in the world’s leading interactive microscopy image analysis software
- Generate isosurface reconstructions for better interpretation and presentation of raw images
- Create high-resolution snapshots and multi-dimensional movies with ease
- Use Imaris Arena to manage your microscopy images on local and network drives.
Add Imaris modules, which include a machine learning object classifier, to explore the subtle, yet biologically important interactions amongst and within cells. Identify, track, and quantify the cells, organelles and proteins within your images.
Cell Biology
BC43 conquers the diverse range of protocols that Cell Biology experiments demand: from a simple 2D snapshot of a cell to understanding dynamic processes with time-lapse.
BC43's unrivalled clarity and speed will save you time without compromising resolution (X,Y or Z) or field of view.
- Confocal mode for fast, high-resolution imaging of tissues
- Widefield mode for higher sensitivity and maximum speeds
- Built in GPU-based ClearView™ technology boosts image clarity
| Andor | BC 43 | Plate-forme L2 |
View
| CRYO DC et EFFET HALL | | A DEF | A DEF | CARAC - DC/BF/MEMS |
View
| CryoNEMS-THz |
cryostat qui permet de faire des mesures RF-NEMS et aussi Opto-THz
| A renseigner | A renseigner | CARAC Team |
View
| CVD Graphene-RTA | Changement de responsabilité au départ à la retraite de Dominique Vignaud.
Four de recuit 1200°C
Gaz : CH4, H2
Vide primaire
| jipelec | Jetfirst100F | CMNF Team |
View
| CVD Nanowire growth MPA | | MPA | MPA | CMNF - Dépôts chimiques |
View
| Dépot Parylene - bati C20S | | Comelec | C20S | CMNF - Dépôts chimiques |
View
| Dincing saw DAD 3240 | | DISCO | DAD 3240 | CMNF - Intégration |
View
| Double enceinte sous vide | Double enceinte sous-vide permettant par exemple la caractérisation de MEMS jusque 300°C
| Non renseigné | Non renseigné | CARAC - DC/BF/MEMS |
View
| DRX | Mis sur boitiers le 01/07/2023
| PANalytical | MRD X’Pert Pro | CMNF - Croissance et caractérisations avancées |
View
| Dry film laminator | This equipment is suitable for the application of dry film resist containing a very thin temperature and/or pressure sensitive adhe-sive layer.
• Sample size: up to 400mm large and up to 8mm thick
• Hot rolls digitally controlled in the 20-200°C temperature range
• Pressure adjustable through the control of the edge gap between rolls
| Bungard | RLM419P | CMNF - Intégration |
View
| E-beam B010 | B010 (EBPG5000Plus) is an e-beam lithography tool. It is capable of writing features smaller than 10nm and placing structures on a substrate with an accuracy of less than 30nm.
Some of the key specifications are outlined in the following:
- 20, 50 and 100keV Thermal Field Emission Gun
- High Resolution Gaussian Beam System
- 50MHz Intelligent Pattern Generator
- 1.25nm minimum pixel size
- Robust Direct Write Mark Detection & Alignment Software
- 10 positions load lock for batch processing of multiple substrates
- Holders for 50mm, 75mm, 100mm wafers, 4 and 5” masks and smaller piece parts
- Overlay and stitching better than 30nm
| RAITH | EBPG 5000 PLUS | CMNF - Lithographie |
View
| E-beam B028 | B028 (EBPG5000Plus) is an e-beam lithography tool. It is capable of writing features smaller than 10nm and placing structures on a substrate with an accuracy of less than 30nm.
Some of the key specifications are outlined in the following:
- 20, 50 and 100keV Thermal Field Emission Gun
- High Resolution Gaussian Beam System
- 50MHz Intelligent Pattern Generator
- 1.25nm minimum pixel size
- Robust Direct Write Mark Detection & Alignment Software
- 10 positions load lock for batch processing of multiple substrates
- Holders for 50mm, 75mm, 100mm wafers, 4 and 5” masks and smaller piece parts
- Overlay and stitching better than 30nm
| RAITH | EBPG 5000 PLUS | CMNF - Lithographie |
View
| ECHO Revolution | Ce microscope hybride « tout-en-un » peut être utilisé pour les méthodes d’observation droites et inversées.
- Imagerie de cellules vivantes : visualisation et capture d'échantillons vivants grâce à la microscopie automatisée en temps réel.
- Incubateur Stage Top (en option) : assure des conditions optimales pour préserver la viabilité des échantillons.
- Multi-canal : capture et superposition de plusieurs longueurs d'onde en fluorescence
- Multi-point : définition de plusieurs points d'acquisition à visualiser et à revoir au fil du temps
- Assemblage d'images : capture et assemblage pour constituer des images haute résolution à grand champ visuel
- Z - stack : acquisition et empilement d'images sur plusieurs plans focaux
- Mise au point automatique : recherche et suivi automatisés du ou des meilleurs plans Z pour la mise au point
- Hyperscan : assemblage d'images à grande vitesse
Caméra monochrome bas niveau de lumière 5 MP et caméra couleur CMOS fond clair 5 MP. Porte-objectif intelligent - l'interface logicielle peut ainsi reconnaître automatiquement l'objectif employé. Logiciel Hyperscan (en option) - scanning ultra rapide et assemblage d'images en mosaïque à des taux d'images par seconde élevés.
Technique d'illumination : Fond clair et épi-fluorescence (contraste de phase disponible en option). LED ultrabrillantes avec cycle de vie de 50 000 heures. Les fonctions de l'écran tactile gèrent les caméras et l'illumination, remplaçant leviers et tourelles manuels. Les oculaires traditionnels sont remplacés par un écran tactile PixelSense™ de 28 pouces facilitant la visualisation. La méthode d'observation droite est idéale pour les lames en verre. Utile pour les applications d'immersion dans l'eau. La méthode d'observation inversée est adaptée aux échantillons vivants dans des chambres fluidiques comme des flacons de culture et des plaques à puits. Elle permet également de manipuler plus facilement les échantillons. Idéal pour les applications de grande distance de travail.
| ECHO | Revolution | Plate-forme L2 |
View
| Electrolyse Au RENA | | RENA | RENA | CMNF - Dépôts physiques |
View
| Electrolyse Cu RENA | | RENA | RENA | CMNF - Dépôts physiques |
View
| Ellipso AutoSE | AutoSE spectroscopic ellipsometer
It enables measurements of optical properties of films having thickness ranging from few nanometers to few microns, between 440 to 1000 nm. It allows rapid and automatic data acquisitions (few seconds). Mapping of optical properties can be easily achieved on samples up to 100 x 100 mm², using the XYZ mtorized stage. Spot sizes down to 25 µm x 25 µm can be selected for local investigation.
The sofware is controlled by DeltaPsi2 sofware
Equipement sur badgeuse BCM depuis le 27mai 2021
| Jobin Yvon | AutoSE | CMNF - Caractérisation In-Line |
View
| ESERIES Laser Ablation | Laser micromachining is emerging as a key technology for structuring, ablating, scribing, cutting, drilling a wide range of materials as diverse as semiconductor crystals, metals and plastics. Ablation selectivity betwen materials can be achieved with a proper selection of wavelength, laser shot repetition rate and beam velocity. Two laser micromachining equipments are available, operating in the nanosecond and femtosecond pulse regimes, respectively.
• UV nanosecond (35ns) diode-pumped (DPSS) lasers source (351 nm)
• Average power up to 8W and pulse energy up to 5 mJoule
• galvanometer deflection with extended field of 50×50mm2
• sample stage up to 300×300 mm2
| OxfordLaser | ESERIES | CMNF - Intégration |
View
| Estrelas (DRIE) | Equipement sur badgeuse BCM depuis le 02 mai 2021
Deep Si etching, SOI
Bosch process
Cryogenic process
Anti-notching apparatus
4" quartz clamp
220 mm electrode
ICP 5 kW @ 2 MHz
HF 600 W @ 13.56 MHz
LF 300 W @ 350 kHz, pulsed
| OIPT, UK | OXFORD Estrelas PlasmaLab Pro 100 | CMNF - Gravure |
View
| Evaporation effet Joule MEB 450S | MEB 450S
1 - 2 - 3 -
Equipement sur badgeuse BCM depuis le 7 avril 2021
| Plassys | MEB 450S | CMNF - Dépôts physiques |
View
| Evaporation MEB 550S (2005-Bâti I) (Ti, Ni, Au, Al, Ge, Mo, Pt, Ag) | Ag, Al, Ge, Ti, Ni, Au, Pt, Mo
500nm maximum
| Plassys | MEB 500S | CMNF - Dépôts physiques |
View
| Evaporation MEB 550S (Tilt -2008-bâti II) (Ti, Ni, Au, Au, Cr, Mo, Pt, Pd) | Cr, Pd, Pt, Mo, Ti, Ni, Au, Au
1µm max
| Plassys | MEB 550S | CMNF - Dépôts physiques |
View
| Evaporation MEB 550SL (2018) (Ti, Ni, Au, Al, Ge, Cr, Pd, Pt) | Equipement sur badgeuse BCM depuis le 7 avril 2021
Ti, Ni, Au, Ge, Al, Pd, Pt, Cr
500nm max
| Plassys | MEB 500SL | CMNF - Dépôts physiques |
View
| Flood Deep UV | | OAI | Deep UV 240 nm | CMNF - Lithographie |
View
| FSM contraintes | | FSM | TC500 | CMNF - Caractérisation In-Line |
View
| FTIR spectrometer Perkin Elmer | | Perkin Elmer | System 2000 | D1 - NCM |
View
| FTIR spectrometer Perkin Elmer | Tri-range MIR/NIR/FIR Fourier-Transform Infrared Spectrometer (FTIR)
Spectral range : from 15000 cm-1 to 30 cm-1
Different accessories available for bulk materials (solid or liquid) or surface analysis (molecular films, polymers)
- Veemax III accessory (from Pike Technologies) : Variable angle single reflection ATR with Ge crystal or variable angle specular reflection with manual control of the angle of incidence
- Gladi ATR accessory (from Pike Technologies ) : ATR with diamond crystal (controle of temperature also possible during analysis)
Different techniques : transmission mode, ATR mode, variable angle specular reflexion
| Perkin Elmer | SPECTRUM 3 | CMNF Team |
View
| FTIR TEST BUG | | Perkin Elmer | test | CANTHER UMR9020 |
View
| Furnace Module 5 left | | Memert | Memert | CMNF - Lithographie |
View
| Furnace Module 5 right | | Memert | Memert | CMNF - Lithographie |
View
| Furnace Module 6 | | Memert | Memert | CMNF - Lithographie |
View
| Goniomètre Kruss | Equipement sur badgeuse BCM depuis le 27 janvier 2021
Kruss Goniometer DSA 100
Measurement of wettability and contact angles for surface characterization (hydrophobic, hydrophilic, super-hydrophobic ...)
For wettability and wall angles measurements
Surfaces Characterization: hydrophilic, hydrophobic…
High-quality instrument used for analyzing wetting and coating processes
The Drop Shape Analyzer – DSA100 is a high-quality system solution for tasks in the analysis of wetting and adhesion on solid surfaces.
From the basic unit for precise measurement of the contact angle to the fully automatic expert instrument for serial measurement of surface free energy (SFE).
Flexible solutions for different tasks
The investigation and optimization of wetting and adhesion behavior. With up to three axes for sample positioning, the sample is moved quickly and reproducibly to the measuring positions. Measurement of the contact angle with up to 8 liquids ensures maximum accuracy when determining the SFE.
The pressurized double-dosing unit allows measuring the SFE extremely fast and reliable.
Quality down to the last detail
The uniform LED illumination and the quality lens ensure high precision when displaying the drop for accurately measuring the contact angle or surface tension. Thanks to the large zoom range, even small drops appear with optimum width in the video image and can therefore be investigated reliably. A protection is provided for sensitive components and the troublesome effect of vibration have been minimized. The high-resolution camera, the lens and the syringes and storage vessels for test liquids are mounted in a robust, enclosed housing.
The position of the drop in the image remains unchanged when the viewing angle is adjusted.
Comprehensive analysis of solids and liquids
The DSA100 measures the surface tension of liquids using the Pendant Drop method. The results can be used to analyze the relationship between the wetting of the solid and the liquid properties. The results help to provide a scientific picture of the interface contact, which can be used, for example, to optimize the adhesion and long-term stability of coatings. Other solutions for measuring the liquid-liquid interfacial tension, for measurements at high pressures and for surface rheology make the DSA100 a universal instrument for interface research.
ADVANCE –Intuitive software solution for measurement tasks
The simple operation of the instrument goes hand-in-hand with the clear user guidance of the ADVANCE software. The relevant functions for each particular step are arranged in tiles which display all elements necessary in the context. By avoiding the use of menus and pop-ups, ADVANCE saves any unnecessary clicks and time-consuming searches for hidden elements. Particularly comfortable is the programming of automatic sequences that integrate the software-controlled components of the DSA100 in complete sample analyses with maximum flexibility. Using these automation programs provides high reproducibility and reduces the user’s influence on the results to a minimum.
Tasks and applications
-Characterization of surface pre-treatment processes
-Investigation of the adhesion and stability of bonding and coating processes
-Investigation of coating substances in accordance with DIN 55660
-Checking the wettability of plastic, glass, ceramic, wood or metal
-Quality control for wafers and microelectronics
-Checking surface cleanliness
-Elasticity of liquid films
-Wetting of microscopically small surfaces
Measuring methods and options
-Contact angle between a liquid and a solid
-Surface free energy from contact angles of several test liquids using all common models
-Static contact angle, advancing angle and receding angle
-Roll-off angle on hydrophobic and superhydrophobic surfaces
-Measurement of surface tension and liquid-liquid interfacial tension using the Pendant Drop method
-Temperature-controlled measurements from -30 to 400°C
-Measurements at controlled humidity
-Surface rheological measurements (modulus of elasticity E'; modulus of viscosity E'')
-Wetting measurements on microscopically small surfaces
| Kruss | n.a | CMNF - Soft Litho |
View
| Gravure HF vapeur | sur BCM badgeuse depuis le 1er janvier 2023
| SPTS-PRIMAXX | µetch module | CMNF - Gravure |
View
| Grinder | Equipement sur BCM depuis le 1er aout 2024
MPS 2 R300 (G&N)
For a fast and agressive mechanical thinning of substrates
A rotation abrasive wheel removes the material on a sample itself in
rotation.
Main characteristics:
• Substrate: 3 inches
• Substrate rotation speed: 0-30 rpm
• Head max rotation speed: 2600 rpm
• Height precision: 3 μm
• Grinding speed: 1-30 μm
• Materials: Silicon SiC glass
Ultra pure deionized water allows cooling during the process.
| G&N | MPS2R300 | CMNF - Intégration |
View
| Hall Effect | Equipement sous badgeuse BCM
| Nanometrics | HL5500 | CMNF - Croissance et caractérisations avancées |
View
| Impédancemètre HP4294A | | HP | 4294A | CARAC Options |
View
| Implanteur | EATON-AXCELIS GA 3204 is a medium current reactor. The possibility to use the materials in different states (gases, salts, metals and liquids) makes this equipment the unique tool in France because of its capability to implant very large range of the chemical species. In the standard mode, it is possible to implant the chemical species from 20kEv to 200 kEv. Recently, the implanter was equipped with deceleration module that makes possible the low energy implantation from 3kEv to 20kEV. One can perform the implantation at different angles to the substrate for 3D structures and with rotated samples and in the wide temperature range, from -10°C to 300°C. The implantation is often followed with the rapid thermal annealing to recover the crystal damage. Two RTA plates are using: Jipelec JetStar 100S and Anealsys One with the max temperature up to 1200°C. The implantation and the annealing are realized by a technician and SRIM simulation by an engineer. No possible “free” using for this tool.
| Eaton-Axcelis, USA | GA3204 | CMNF - Thermique et Implantation |
View
| Impression Jet d'encre | | CERADROP | CERAPRINTER X-series | CMNF - Dépôts physiques |
View
| JSERIES Laser Ablation | Laser micromachining is emerging as a key technology for structuring, ablating, scribing, cutting, drilling a wide range of materials as diverse as semiconductor crystals, metals and plastics. Ablation selectivity betwen materials can be achieved with a proper selection of wavelength, laser shot repetition rate and beam velocity. Two laser micromachining equipments are available, operating in the nanosecond and femtosecond pulse regimes, respectively.
• Multi-wavelength femtosecond (300fs) diode-pumped (DPSS) lasers source (UV343,GR515,IR1030nm)
• Average power up to 20W and pulse energy up to 100 μJoule in IR
• Repetition rate up to 2MH
| OxfordLaser | JSERIES | CMNF - Intégration |
View
| Keithley - Pulsé | | Keithley | 4200-SCS | CARAC Options |
View
| Keithley Statique | | Keithley | 4200-SCS | CARAC Options |
View
| KOH Bench | | Chemical bench | Chemical bench | CMNF - Dépôts chimiques |
View
| Laser FEMTO - Pompe-sonde | | Spectra-Physics | MAI-TAI | vide |
View
| Laser Femtoseconde | | Spectra-Physics | MAI-TAI HP | PCP - Domaine UHV |
View
| Leica DMi8 | Leica DMi8 Microscope
-Phase-contrast and fluorescence microscopy
-X, Y and Z motorized stage
-Adaptativ focus control for time lapse experiment
-Incubation chamber for the control of temperature and CO2 level for real time imaging
This microscope makes it possible to make acquisitions in phase contrast and epi-fluorescence. It is equipped with a motorized X, Y and Z stage. The Adaptive Focus Control (AFC) allows long-term acquisitions without focus drift over time. The temperature-controlled and CO2-controlled environmental enclosure allows real-time imaging of devices possibly coupled to microfluidics.
The microscope is equipped with a large chamber incubation system for the stabilization of temperature and humidity which is designed for pre-heating cell and tissue cultures.
Providing extra space for large and long-term experiments, this large incubator can easily accommodate small or large equipment within their tightly controlled environment.
This incubator is used in combination with a Heating Unit 2000. Temperature control is carried out with the TempController 2000-2.
For a local CO2 gassing, the system has been upgraded with specific Heating Inserts and CO2-Covers in combination with the CO2 Controller 2000. A Humidification Bottle is provided with every gassing unit.
| Leica | Leica DMi8 | Plate-forme L2 |
View
| Manips diverses 1 | | Non renseigné | Non renseigné | CARAC Team |
View
| Manips diverses 2 | | Non renseigné | Non renseigné | CARAC Team |
View
| Mask Aligner (left) | • Wafer size from 1⁄4 to 4 inch and mask size: quartz 4*4 and 5*5
• Exposure mode: Proximity, soft, hard and vacuum contact
• Top side alignment (TSA) down to 0.5μm, bottom side alignment (BSA) down to 1 μm
• Resolution with vacuum contact down to 800 nm with resist Aznlof 2020
Equipement sous badgeuse BCM
| SUSS MICROTEC | MA6/BA6 | CMNF - Lithographie |
View
| Mask Aligner (right) | • Wafer size from 1⁄4 to 4 inch and mask size: quartz 4*4 and 5*5
• Exposure mode: Proximity, soft, hard and vacuum contact
• Top side alignment (TSA) down to 0.5μm, bottom side alignment (BSA) down to 1 μm
• Resolution with vacuum contact down to 800 nm with resist Aznlof 2020
Equipement sous badgeuse BCM
| SUSS MICROTEC | MA6/BA6 | CMNF - Lithographie |
View
| MBE 2D | Equipement sur boitiers BCM depuis le 1er juillet 2023
| VINCI Technologies | UHV E-Beam & MBE | CMNF - Croissance et caractérisations avancées |
View
| MBE C21 Gaz | Equipement sur boitiers (BCM) depuis le 1er juillet 2023
| RIBER | C21 TM | CMNF - Croissance et caractérisations avancées |
View
| MBE Graphène / BN | Equipement mis sur boitiers BCM depuis le 1er juillet 2023
| RIBER | C21S | CMNF - Croissance et caractérisations avancées |
View
| MEB Hitachi FlexSEM 1000 II |
The FlexSEM 1000 II Scanning Electron Microscope features newly designed electron optical and signal detection systems providing unparalleled imaging and analytical performance in a lab-friendly configuration. Keeping efficiency in mind, the FlexSEM features an adaptable, separable, and compact design, such that it can be installed in limited office, laboratory, or even mobile spaces. Engineered to appeal to both the novice and expert microscopist for a wide range of applications, including biological and advanced material specimens, this microscope will certainly expand your analyses as well as your expectations.
Compact & High-Performance Column
Best-in-class resolution in a compact system. The FlexSEM employs a newly designed electrical optical system with a reliability-proven high-sensitivity detector, achieving imaging at 4 nm.
High resolution image
The electron optics incorporate a low aberration objective lens and a unique gun bias system that allows delivery of high emission current.
Ultra-Variable-Pressure Detector
Novel low vacuum technologies enable observation of the surface of non-conductive specimens without preprocessing, across the entire pressure and accelerating voltage ranges.
New & Improved Auto Functions
The user interface is easy to operate even by novice users, and with the various automated functions, high-quality and quick data acquisition can be accomplished regardless of user experience level. A touch panel operation is possible.
Intuitive & Correlative Navigation
SEM MAP helps to locate regions of interest quickly, and delivers accurate correlated optical and SEM images using only one click. Optical and EM correlation function, SEM MAP is fully integrated into the graphical user interface.
| Hitachi | FlexSem 1000 II | CANTHER UMR9020 |
View
| MEB instrumenté (Nanoprober/SMM) | | TESCAN | A définir | CARAC - Nanocaractérisation |
View
| Megasonic cleaning | Equipement sur BCM depuis le 1er aout 2024
| SPS | Megasonic | CMNF - Intégration |
View
| Meyer Burger IonSys 500 (RIBE) | In Ion Beam Etching (IBE), also known as Ion Beam Milling (IBM), an inert ion beam is used for pure physical sputtering of the sample material. This technique is commonly used for structuring metals or other materials which are not accessible to chemical etch processes. Reactive Ion Beam Etching (RIBE) uses reactive process gases to generate a reactive ion beam. Physical and chemical etch components and related selectivities may be easily varied by the energy of the ion beam. Finally Chemically Assisted Ion Beam Etching (CAIBE) uses an inert ion beam in a reactive gas background. Here the ions drive surface reactions with the absorbed reactive species. Based on these process features, ion beam etching might serve applications difficult to be addressed by common etch technologies.
Generally ion beam milling is applied for materials which may not be etched on a chemical basis, like most metals used in MEMS manufacturing. As a second important feature, one may utilize the directed ion flux and the angle dependence of the milling rate. This way defined and/or variable side wall angles in microstructures may easily be generated. Also, by choosing a specific ion incident angle, process rates and selectivity may be optimized.
Badgé BCM 04/06/2021
| Meyer Burger, D | IonSys 500 | CMNF - Gravure |
View
| Micro-soudeuse WB 100 | Equipement sous badgeuse BCM
| JFP | WB 100 | CMNF - Intégration |
View
| N1259A | | Keysight | N1259A | CARAC - DC/BF/MEMS |
View
| Napson | | NAPSON | NC-10 | CMNF - Caractérisation In-Line |
View
| Navigator8 | Asher tool.
Gases: O2 (500 sccm), CF4 (10 sccm), N2 (50 sccm)
Power: 13.56 MHz, 1000 W
Pressure: 50 - 1000 mTorr
Chamber heating: 20 - 250 °C
Chuck heating: 20 - 250 °C
Equipement sur badgeus eBCM depuis le 15 novembre 2021
| Plasmatherm | Navigator8 | CMNF Team |
View
| NVNA | | Keysight Technologies | N5245A | CARAC - NonLinéaire |
View
| Olympus IX71 | Olympus IX71 Microscope
This microscope is equiped with:
-a high-sensitivity high-speed camera
-allows phase contrast microscopy
-epi-fluorescence microscopy
-It is also equiped with a heated and motorized X, Y stage
Available Filter cube:
-Cube n°1: UMWB2 (similar to FITC) ex: BP 460-490/ Em: BA 520 IF
-Cube n°2: UMWG2 (similar to TRITC) ex: BP 510-550 /Em: BA 590
-Cube n°3: Cy5 UN 41008 (similar to Cy5) ex : HQ 620/660X / Em : HQ 700/75 M
-Cube n°4: Four wavelength filter cube: LED-DA/FI/TR/Cy
-DAPI : ex : BP 392-25 Em: BP 432-25
-FITC : ex : BP 474-25 Em: BP 515-25
-TRITC : ex : BP 554-25 Em: BP 595-25
-Cy5: ex: BP 635-25 Em: BP 730-75
Available LED:
-365 nm
-470 nm
-550 nm
-660 nm
| Olympus | IX71 | D2 - BIOMEMS |
View
| Optical profiler | The Contour GT-X is a stand-alone optical surface-profiling system. It measures surface topography with high accuracy in a range from fractions of a nm up to approximately 10mm. The system contains motorized x/y, tip/tilt and z stages to enable automated production monitoring. It is equipped with four interferometric objectives of magnification 2.5x, 10x, 50x and 115x
| Bruker | Contour GT X | CMNF - Intégration |
View
| Organic chemistry Lab | | Room | Benches | CMNF - Dépôts chimiques |
View
| Oxford ICP Ch1 (ICP-RIE) | One of two chambers on the Oxford Plasmalab System 100 cluster.
This chamber has the following gases available: Ar, CH4, Cl2, H2, O2, SF6
It is mainly for etching InP, InGaAsP, InGaAs, ...
The electrode can be actively cooled (min 0 °C) and actively heated (max 100 °C)
Equipement sur badgeuse BCM depuis le 21 mai 2021
| OIPT, UK | ICP PlasmaLab 100 | CMNF - Gravure |
View
| Oxford ICP Ch2 (ICP-RIE) | One of two chambers on the Oxford Plasmalab System 100 cluster.
This chamber has the following gases available: Ar, BCl3, Cl2, O2, SF6
It is mainly for etching GaAs, AlGaAs, GaN...
The electrode can be actively cooled (min 0 °C) (no heating).
Equipement sur badgeuse BCM depuis le 21 mai 2021
| OIPT, UK | ICP PlasmaLab 100 | CMNF - Gravure |
View
| PCR |
The CFX Connect Real-Time PCR Detection System offers two-target analysis, excellent thermal cycler specifications, and the same reliable performance as the CFX96 Touch Real-Time PCR Detection System. The system incorporates innovative optical technologies with powerful software to provide maximal reliability and efficiency for all your real-time PCR needs.
PCR is an enzymatic amplification technique in vitro, allowing from a fragment of DNA to obtain a large number (several million) of identical copies of the same fragment. QPCR (quantitative PCR) allows the detection, characterization and quantification of DNA in many applications. The device available is a qPCR device (PCR Biorad CFX connect) which allows the PCR amplification process to be monitored in real time.
| Biorad | CFX connect | Plate-forme L2 |
View
| PDMS Station | PDMS station consists of the following equipment:
-precision scale
-dessicator
-oven
-plasma torch
| nc | nc | CMNF - Soft Litho |
View
| PECVD Bati3 | Silicon Oxyde, Silicon Nitride and Oxynitride deposition by PECVD. Film stress can be controlled by high / low frequency mixing techniques. Temperature range : 20°C --> 350°C. Thickness : 5nm to 3µm. Uniformity : 3% on 6 inches wafers.
Equipement sur badgeuse BCM depuis le 5 mai 2021
| Oxford Instruments | Plasmalab80Plus | CMNF - Dépôts chimiques |
View
| Photopatterning Primo Alvéole | Manufacture custom microenvironments in vitro, with micrometric control of their topography, rigidity and chemistry
Micropatterning, hydrogel polymerization and microfabrication
Create in vitro cellular microenvironments
Functionalize and / or structure substrates
Alvéole develops innovative tools improving the quality of the cell sample preparation for cell biology and microscopy.
Through the fine-tuning of cell microenvironment in vitro, this bioengineering platform provides biologists the control over the development and proliferation of living cells in culture.
Functionalize and/or structure your substrates and generate better in vitro cell models for:
enhancing the physiological relevance of your cell biology experiments,
screening different conditions, facilitating whole-cell cryo-ET imaging.
Micropatterning, hydrogel polymerization and microfabrication, all in a single device. Create bespoke in vitro cellular microenvironments and get better cell models for your cell biology experiments or cryo-ET studies.
Studying the influence of the microenvironment on intracellular and intercellular mechanisms has been essential for research in cell biology, for many years now. But in this quest, in vitro cell experiments confront researchers with many challenges, such as:
-the recurring reproducibility issues,
-reliability in term of physiological relevance,
-but also ease of use,
-and efficiency
Developed by Alvéole scientists after the LIMAP* technology (Strale P.O. et al, Adv Mater. 2016), the PRIMO maskless photopatterning system (DMD based) can engineer custom in vitro cell microenvironments through three techniques: micropatterning, hydrogel structuration and microfabrication.
PRIMO workflow for better in vitro cell models:
1-SUBSTRATE selection and preparation
2-PATTERN DESIGN and upload in Leonardo software
3-UV PROJECTION BY PRIMO for micropatterning, microfabrication, hydrogel polymerization
4-USING CUSTOM in vitro CONDITIONS for better cell experiments
Micropatterning
allows to precisely control cell adhesion to mimic in vivo phenotypes, isolate them or place them in reproducible conditions for standardized assays.
Microfabrication
PRIMO maskless DMD-based photopatterning system can perform greyscale photolithography on greyscale resists to create complex 3D molds such as ramps, curving wells or microfluidic chips for organ-on-a-chip applications.
Hydrogels
As a photopatterning system, PRIMO can also polymerize and photo-scission most commonly used hydrogels for applications such as 3D cell culture or permeable hydrogel membranes polymerization within microfluidic chips.
Fields of application
Adjust the biochemical and mechanical cues of the cell microenvironment in vitro with PRIMO and generate more physiologically-relevant cell models.
The system allows you to better study the behavior and development of living cells in a broad range of applications, such as: cytoskeleton dynamics, cell adhesion force measurement, cell confinement, cell migration, tissue engineering, spheroids.
-Substrate structuration: microfabrication, hydrogel structuration
-Micropatterning, Surface functionalization: biomolecule micropatterning
-Substrate structuration and Functionalization: complex cell microenvironments
| Alvéole | Primo | Plate-forme L2 |
View
| Pick-and-place | The Flip Chip Die Bonder model PP6-6 is designed for accurate placement of delicate devices on substrate.
It achieves high accuracy placement using high magnification optical device.
The machine provides for single collet vacuum pick and place of die from waffle pack, wafer, Gel-Pak or bulk die media and features adjustable and repeatable subsonic scrub. The placement accuracy is < 3μm, upon configuration.
Small and large devices can placed with flipped vision.
All Process options of PP6 series are available on PP6-6.
A full automated die bonding sequence with according epoxy pattern are programmable Off-Line… as a simple matrix or multiple locations..
A robust, and reliable mechanical concept, designed to be external vibration free.
| JFP | PP6 Flexible Rework station | CMNF - Intégration |
View
| PICO | -Nettoyage de matériaux
La technologie plasma offre des solutions pour tout type de contamination et n’importe quel substrat quel que soit le traitement ultérieur. Des résidus de contamination moléculaire sont également évacués.
-Activation de matériaux
Une bonne mouillabilité de la surface constitue la condition préalable à l'adhérence d'éléments lors de l'application de peintures, colles, de l'impression ou de liants.
-Cleaning of materials
Plasma technology offers solutions for any type of contamination and any substrate regardless of subsequent processing. Residues of molecular contamination are also evacuated.
-Activation of materials
A good wettability of the surface is the prerequisite for the adhesion of elements during the application of paints, glues, printing or binders
https://www.plasma.com/fr/plasma-basse-pression-pico/
bcm_29/09/2021
| Diner Electronic GmbH | Diener Pico | CMNF - Soft Litho |
View
| Piegeage optique | | Non renseigné | Non renseigné | CARAC Team |
View
| Polisseuse LOGITECH | Equipement sur BCM depuis le 1er aout 2024
| LOGITECH | PM5 | CMNF - Intégration |
View
| Polisseuse manuelle PRESI |
The MINITECH Polishing machine is robust, powerful and reliable, it allows an easy use and simple maintenance. The machine provides a constant rotation of the plate, whatever the force applied, giving the possibility to polish large sized samples. MINITECH range can be equipped with plates Ø 200mm or Ø 250mm.
| PRESI | Minitech 233 | CMNF - Intégration |
View
| Profilomètre alphastep 500 | | Tencor | Alphastep 500 | CMNF - Caractérisation In-Line |
View
| Profilomètre alphastep IQ | | Tencor | Alphastep IQ | CMNF - Caractérisation In-Line |
View
| Profilomètres Bruker | Mesures de hauteur de 10nm à 1mm.
Utilisable après formation par le tuteur techno de l'équipe.
| Bruker | dektak xt | CMNF - Caractérisation In-Line |
View
| PSM n°1 | This resource includes all the equipment necessary for cell culture:
-A type II microbiological safety cabinet (PSM II, Thermo Scientific MSC advantage) which is an enclosure for handling biological samples while ensuring the safety of the user and the environment, and for working in sterile conditions
-A CO2 oven (Memmert), a central element in cell culture, since it makes it possible to maintain cell cultures under suitable conditions of temperature (37 ° C) and atmosphere (environment at 5% CO2)
-Water bath (Grand, JB Nova 12): used when maintaining cell lines
-Control tools: Leica DMi1 inverted microscope, for the control of cell proliferation as well as a cell counter (Life Technologies Countess II)
| n.a | n.a | Plate-forme L2 |
View
| PSM n°2 | | Carlo Erba | n.c | Plate-forme L2 |
View
| PSM n°3 | | Carlo Erba | n.c | Plate-forme L2 |
View
| Pulvé 4" gauche | Pulvérisation DP650 N°34- 4" gauche
1 - NbTi
2 - Pt
3 - Ti
4 - Au
5 - Al
6 - W
Equipement sur badgeuse BCM depuis le 7 avril 2021
| Alliance Concept | DP650 N°34 | CMNF - Dépôts physiques |
View
| Pulvé 6" droite | Pulvérisation DP650 N°24-6" droite
1 - Ti
2 - Al
3 - Au
4 - Cu
Equipement sur badgeuse BCM depuis le 7 avril 2021
| Alliance Concept | DP650 N°24 | CMNF - Dépôts physiques |
View
| Pulvé Elettrorava (2023) | 12 cathodes 4 pouces en confocal
3 bouquets de 4 cathodes : 1 poste DC, 1 poste RF, 1 poste HIPIMS
DC, RF, HIPIMS
SAS avec cassette 5 places
Chargement et traitement individuel
Ar, O2, N2
Non-uniformité < 5% sur 4 pouces
| Elettrorava | - | CMNF - Dépôts physiques |
View
| RC8 Ebeam Module 6 | Equipement sur badgeuse BCM depuis le 1er janvier 2021
| SUSS MICROTEC | RC8 | CMNF - Lithographie |
View
| RC8 Opt Module 3 | Equipement sur badgeuse BCM depuis le 1er janvier 2021
| SUSS MICROTEC | RC8 | CMNF - Lithographie |
View
| RC8 Opt Module 5 | Equipement sur badgeuse BCM depuis le 1er janvier 2021
| SUSS MICROTEC | RC8 | CMNF - Lithographie |
View
| RCD8 dedicated process Module 7 | Equipement sur badgeuse BCM depuis le 1er janvier 2021
| SUSS MICROTEC | RCD8 | CMNF - Lithographie |
View
| RCD8 Ebeam Module 5 | Equipement sur badgeuse BCM depuis le 1er janvier 2021
| SUSS MICROTEC | RCD8 | CMNF - Lithographie |
View
| RCD8 Opt module 4 | Equipement sur badgeuse BCM depuis le 1er janvier 2021
| SUSS MICROTEC | RCD8 | CMNF - Lithographie |
View
| Reflectometer | | Micropack | Nanocalc 2000-UV-IR | CMNF - Lithographie |
View
| Réflectomètre 6 ports | | Home made | home made | CARAC - Hyperfréquences |
View
| RF1(Cluster CT200) | | Alliance Concept | RF1 CT200 | CMNF - Dépôts physiques |
View
| RF2(Cluster CT200) | | Alliance Concept | RF2 CT200 | CMNF - Dépôts physiques |
View
| RTA AnealSys | | AnnealSys, FRA | AnnealSys AS-ONE | CMNF - Thermique et Implantation |
View
| RTA Jipelec III-V | Equipement sur badgeuse BCM depuis le 7 avril 2021
| Jipelec | Jetfirst 200 | CMNF - Thermique et Implantation |
View
| RTA Jipelec implanteur | | Jipelec | Jipelec JetStar100S | CMNF - Thermique et Implantation |
View
| Sawatec module 4 | | Sawatec | HP200 HMDS | CMNF - Lithographie |
View
| Sawatec module 7 | | Sawatec | HP200 HMDS | CMNF - Lithographie |
View
| Sawatec module 7bis | | Sawatec | HP300 | CMNF - Lithographie |
View
| Sécheur CO2 supercritique | | sc fluids | Sécheur SC fluids | CMNF - Gravure |
View
| SEMILAB | Non contact plateform. Samples inspection, quality control, process monitoring. Solar cell characterization. Minority Carrier life time. LBIC. Non-contact resistivity (eddy current).
| SEMILAB | WT-2000PVN | CMNF - Caractérisation In-Line |
View
| Sentech (ICP-RIE) | Available process gases:
Gas name |
Max Flow (sccm) |
SiCl4 |
50 |
BCl3 |
200 |
Cl2 |
100 |
HBr |
100 |
SF6 |
500 |
CF4 |
200 |
CHF3 |
200 |
CH4 |
100 |
H2 |
100 |
N2 |
50 |
Ar |
50 |
He |
50 |
O2 |
50 |
- He (for wafer backside cooling)
- N2 (for system venting)
Equipement sur badgeuse BCM depuis le 02 mai 2021
| Sentech GmbH, D | SENTECH SI 500 | CMNF - Gravure |
View
| Si_DRIE_02 | Etching tool dedicated to Silicon only. No apparent metals allowed, no metal masks.
Etch stop layers allowed:
Si, SiO2, SiN, photoresists are the ONLY materials permitted as etch stop layers.
Mask allowed:
Photoresist, SiO2, SiN are the ONLY permitted masks
Training is provided that includes 1- course given in IEMN amphitheater about plasma basics and intriduction to DRIE,
2- practical training on the tool.
| SPTS | CMNF(gra)CT_42 | CMNF Team |
View
| SMM Keysight | | Keysight | SMM 40 GHz | CARAC - Nanocaractérisation |
View
| SNOM MIR THz | | Neaspec | Neaspec | CARAC - Nanocaractérisation |
View
| Spectroscopie gaz ou particules | | Menlo System | TeraSmart | CARAC - Millimétrique THz |
View
| Spin-Coater | The Laurell WS-650-23 B spin coater system will accommodate up to ø150mm wafers and 5" × 5" (127mm × 127mm) substrates, and features a maximum rotational speed of 12,000 RPM (based on a ø100mm silicon wafer).
The WS-650 series is typically employed for Solvent, Base or Acid-based processing:
-Coating
-Etching
-Developing
-Rinsing-Drying
-Cleaning.
The process controller allows operator interaction in real-time during the process execution including pausing time, stopping and continuing from that point.
The housing for this system is made from a solid co-polymer blend which is able to resist solvents and strong acids and bases.
The closed bowl design, coupled with the precision of the process controller, allows most coating materials to dry in a quiescent state, increasing uniformity and minimizing particle contamination.
A proprietary labyrinth seal protects the motor and control electronics from chemical contamination. This seal provides the process chamber with Nitrogen purge and has been proven to be particle-free on a sub-micron level during field testing.
bcm_29/09/2021
| Laurell Technologies Corporation | WS-650 series | CMNF - Soft Litho |
View
| SPM Omicron VT | VT-AFM Omicron
Sample size: 1 centimeter square
X,Y Scan range: 10µmx10µm, Z range 2µm
Resolution: Sub nanometric, Atomic
Working mode: EFM, KPFM, CAFM, STM
Environment: UHV chamber
Temperature working range: from 50K to 1000K
Term of use: with engineer assistance
| Omicron | VT-AFM/STM | PCP - Domaine UHV |
View
| SPM SPECS JT | Low temperature Scanning Probe Microscope with Joule-Thomson stage and magnetic field
- STM/AFM measurments with Length Extension Resonator (Kolibri sensor)
- Nanonis controller
- min temperature : 1.4K
- max magnetic field 3T perpendicular to sample surface
- LEED
| SPECS | JT-SPM | PCP - Domaine UHV |
View
| Station 110GHz | | A DEF | A DEF | CARAC - Hyperfréquences |
View
| Station 26.5GHz Multiports | | Keysight Technologies | à déf | CARAC - NonLinéaire |
View
| Station 300-750GHz | | A DEF | A DEF | CARAC - Millimétrique THz |
View
| Station Dark Box | | . | . | CARAC - DC/BF/MEMS |
View
| Station flex Hirox | | . | . | CARAC - Hyperfréquences |
View
| Station haute tension | | Keysight Technologies | B1505A | CARAC - DC/BF/MEMS |
View
| Station IV | | . | . | CARAC - DC/BF/MEMS |
View
| Station Korigan 67 GHz | | A DEF | A DEF | CARAC - Hyperfréquences |
View
| STATION PM5 | | A DEF | A DEF | CARAC - Hyperfréquences |
View
| Station PM8 140-300 GHz | | à définir | à définir | CARAC - Millimétrique THz |
View
| Station PM8 Tuner WR10 | | . | . | CARAC - Millimétrique THz |
View
| Station sous vide | | . | . | CARAC - DC/BF/MEMS |
View
| STM Omicron LT | Low-Temperature Scanning Tunneling Microscope
Surface imaging down to the atomic scale.
Electrical testing on surfaces or nanostructures with atomic precision and ultra-low drift rate (<10pm/h).
All modes of operation compatible with low temperature down to 4K.
| Omicron | LT-STM | PCP - Domaine UHV |
View
| STM Omicron Nanoprobe |
-
Microscopie à effet tunnel (STM)
-
Microscopie électronique à balayage (MEB)
-
Localisation et manipulation
-
Mesures de transport multipointes et multi-échelles
-
Chambre de préparation reconfigurable
| Omicron | Nanoprobe | PCP - Domaine UHV |
View
| STM Omicron RT |
- Dépôt de matériaux (molécules, métaux, semiconducteurs)
-
Préparations (recuits, bombardements)
-
Diffraction d’électrons lents (LEED)
-
Spectroscopie AUGER
-
Microscopie à effet tunnel (STM)
| Omicron | RT-STM1 | PCP - Domaine UHV |
View
| Supra55VP | Equipement sur badgeuse BCM depuis le 1er janvier 2021
| ZEISS | supra55VP | CMNF - Caractérisation In-Line |
View
| Table Optique / HF /Espace libre | | A DEF | A DEF | CARAC - Millimétrique THz |
View
| TEPLA (Stripping, ashing) | Applications
- Photoresist stripping
- Surface cleaning after storage
- Surface cleaning after processes (photolithography, wet etching dry etching)
- Removal of organic passivating layers and masks
- Resist descum process
| PVA TePla AG, D | PVA Tepla 300 semi auto | CMNF - Gravure |
View
| Thinky Mixer | The association of the vacuum function with the rotary and revolutionary movements allows the complete deaeration of almost all fluids.
The centrifugal force prevents any flow of the mixture during the operation.
The ARV-310 enables to make deaerated mixtures of high viscosity urethane materials in minutes.
The memory mode allows the user to reproduce the optimal conditions of their own mixes for high repeatability and constant
Technical Description:
-Vacuum function: optimal bubble-free dispersion
-Deaerated mixture of highly viscous materials
-Guaranteed without flow, sedimentation or foam during the operation
-Environmental friendliness: mixtures in closed areas
-Modifiable RPM for mixtures of all types
-Viscosity regulator
bcm 29/07/2021
| n.a | n.a | CMNF - Soft Litho |
View
| Through-hole Copper Plating Line | | Bungard | Compacta 30 ABC | CMNF - Intégration |
View
| TMAH Bench | | Chemical bench | Chemical bench | CMNF - Dépôts chimiques |
View
| Tube A1 Thermal Oxidation | | Tempress | TS6303-4 | CMNF - Dépôts chimiques |
View
| Tube A2 Doped Poly process | | Tempress | TS6303-4 | CMNF - Dépôts chimiques |
View
| Tube A3 LTO BPSG | | Tempress | TS6303-4 | CMNF - Dépôts chimiques |
View
| Tube B1 Thermal oxidation | | Tempress | TS6303-4 | CMNF - Dépôts chimiques |
View
| Tube B2 OxiNitride | | Tempress | TS6303-4 | CMNF - Dépôts chimiques |
View
| Ultra55 | Equipement sur badgeurse BCM depuis le 1er janvier 2021
| Zeiss | Ultra55 | CMNF - Caractérisation In-Line |
View
| UV Laser | install bcm juin 2022
High Resolution Direct Lithography System for fast Prototyping and Maskless Fabrication
• Laser source 375 nm, 73 mW
• Wafer writing area 100 x 100 mm
• Laser spot size: 1μm and 10 μm
• Stage travel resolution and repeatability: 100 nm
| KLOE | DILASE 650 | CMNF - Lithographie |
View
| UV/ozone cleaner | | Jelight | Model 42 | D1 - NCM |
View
| UV-Vis Spectrometer Perkin Elmer | | Perkin Elmer | Lambda 800 | D1 - NCM |
View
| Wafer Bonding_Wax | Equipement sur BCM depuis le 1er aout 2024
| LOGITECH | Single wafer bonder unit | CMNF - Intégration |
View
| Wafer Scriber / Breaker | | JFP Microtechnic | Model 100 | CMNF - Intégration |
View
| Vibromètre Polytec MSA 500 | | Polytec | MSA 500 | D2 - NAM6 |
View
| XeF2 | Equipement sur badgeuse BCM depuis le 7 avril 2021
| Xactix, USA | Xetch Xactix X3B | CMNF - Gravure |
View
| XPS (ESCA) | | Physical Electronics | 5600 | CMNF - Croissance et caractérisations avancées |
View
| ZTest tool | Lite test-text
| Testbolaget | A | CMNF - Caractérisation In-Line |