Laser micromachining is emerging as a key technology for structuring, ablating, scribing, cutting, drilling a wide range of materials as diverse as semiconductor crystals, metals and plastics. Ablation selectivity betwen materials can be achieved with a proper selection of wavelength, laser shot repetition rate and beam velocity. Two laser micromachining equipments are available, operating in the nanosecond and femtosecond pulse regimes, respectively.

 

• Multi-wavelength femtosecond (300fs) diode-pumped (DPSS) lasers source (UV343,GR515,IR1030nm)

• Average power up to 20W and pulse energy up to 100 μJoule in IR

• Repetition rate up to 2MH