The substrate to be diced is positionned on a flexible adhesive film and fixed on the chuck. After alignment between the cutting ways on the substrate and the blade, the substrate moves at a selected speed under the blade. The blade is cooled by water jet and its rotation speed is controlled. Dicing can be made in manual or automatic ways.
Main characteristics:
• Rotation speed of the blade: 6,000 - 60,000 rpm
• Chuck displacement speed: 0.1 - 600 mm/s
• Substrates size: up to 8 inches max
• Materials: III-V materials, silicon, glass, ceramics, SiC saphir
• Optical alignnment of the blade
sur cross le 01/02/2025