Picture of Oxford ICP Ch1 (ICP-RIE)
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CMNF - Gravure
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One of two chambers on the Oxford Plasmalab System 100 cluster. 

This chamber has the following gases available: Ar, CH4, Cl2, H2, O2, SF6

It is mainly for etching InP, InGaAsP, InGaAs, ...

The electrode can be actively cooled (min 0 °C) and actively heated (max 100 °C)

Tool name:
Oxford ICP Ch1 (ICP-RIE)
Manufacturer:
OIPT, UK
Model:
ICP PlasmaLab 100

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