Laser micromachining is emerging as a key technology for structuring, ablating, scribing, cutting, drilling a wide range of materials as diverse as semiconductor crystals, metals and plastics. Ablation selectivity betwen materials can be achieved with a proper selection of wavelength, laser shot repetition rate and beam velocity. Two laser micromachining equipments are available, operating in the nanosecond and femtosecond pulse regimes, respectively.

 

• UV nanosecond (35ns) diode-pumped (DPSS) lasers source (351 nm)

• Average power up to 8W and pulse energy up to 5 mJoule

• galvanometer deflection with extended field of 50×50mm2

• sample stage up to 300×300 mm2