Picture of ESERIES Laser Ablation
Current status:
AVAILABLE
Book | Log
Show/Collapse all

Group:
CMNF - Int├ęgration
You must be logged in to view files.
Laser micromachining is emerging as a key technology for structuring, ablating, scribing, cutting, drilling a wide range of materials as diverse as semiconductor crystals, metals and plastics. Ablation selectivity betwen materials can be achieved with a proper selection of wavelength, laser shot repetition rate and beam velocity. Two laser micromachining equipments are available, operating in the nanosecond and femtosecond pulse regimes, respectively.
 
• UV nanosecond (35ns) diode-pumped (DPSS) lasers source (351 nm)
• Average power up to 8W and pulse energy up to 5 mJoule
• galvanometer deflection with extended field of 50×50mm2
• sample stage up to 300×300 mm2
Tool name:
ESERIES Laser Ablation
Manufacturer:
OxfordLaser
Model:
ESERIES

Instructors

Licensed Users

You must be logged in to view tool modes.