Substrate bonder: SB6e Suss MicroTec
Vacuum anodic bonder
The KS Bonder is a semi-automatic, computer-controlled, stand-alone substrate bonder equipped with a vacuum/pressure chamber and a loading arm. The machine processes aligned and unaligned wafers, substrates and chips. The alignment accuracy of this tool is listed as being 3 μm (3 σ ). All bonding pair alignment is done on the BA6 tool , the substrate stacks are mechanically clamped using the transport fixture, and then transported and bonded in the SB6 chamber.
For aligned and unaligned wafers using thermo-compression, anodic, fusion, adhesive or any related bond technology.