Etching tool dedicated to Silicon only. No apparent metals allowed, no metal masks.
Etch stop layers allowed:
Si, SiO2, SiN, photoresists are the ONLY materials permitted as etch stop layers.
Photoresist, SiO2, SiN are the ONLY permitted masks
Training is provided that includes 1- course given in IEMN amphitheater about plasma basics and intriduction to DRIE,
2- practical training on the tool.