Picture of Mask Aligner (right)
Current status:
AVAILABLE
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Group:
CMNF - Lithographie
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• Wafer size from 1⁄4 to 4 inch and mask size: quartz 4*4 and 5*5
• Exposure mode: Proximity, soft, hard and vacuum contact
• Top side alignment (TSA) down to 0.5μm, bottom side alignment (BSA) down to 1 μm
• Resolution with vacuum contact down to 800 nm with resist Aznlof 2020

 

Equipement sous badgeuse BCM

Tool name:
Mask Aligner (right)
Manufacturer:
SUSS MICROTEC
Model:
MA6/BA6

Instructors

Licensed Users

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