MPS 2 R300 (G&N)
For a fast and agressive mechanical thinning of substrates
A rotation abrasive wheel removes the material on a sample itself in
rotation.

Main characteristics:
• Substrate: from 2 to 8 inches
• Five 4 inches substrates max
• Substrate rotation speed: 0-30 rpm
• Head max rotation speed: 2600 rpm
• Height precision: 3 μm
• Grinding speed: 1-30 μm
• Materials: Silicon SiC glass
Ultra pure deionized water allows cooling during the process.