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TEPLA (Stripping, ashing) (CMNF(gra)CT_45_BCM)
Current status:
AVAILABLE
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Group:
CMNF - Gravure
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Description
Applications
Photoresist stripping
Surface cleaning after storage
Surface cleaning after processes (photolithography, wet etching dry etching)
Removal of organic passivating layers and masks
Resist descum process
Details
Tool name:
TEPLA (Stripping, ashing)
Manufacturer:
PVA TePla AG, D
Model:
PVA Tepla 300 semi auto
Typical process information
Number
O2
CF4
Ar
Power
(W)
Nominal
Time
(min)
1
525
0
0
500
1
2
525
0
0
500
5
3
525
0
0
500
10
4
525
0
0
500
15
5
525
0
0
500
30
6
525
0
0
500
60
7
525
0
0
700
5
8
525
0
0
700
10
9
525
0
0
700
15
10
525
0
0
700
30
11
525
0
0
700
60
12
525
0
0
800
5
13
525
0
0
800
10
14
525
0
0
800
15
15
525
0
0
800
30
16
525
0
0
800
60
17
525
0
0
1000
5
18
525
0
0
1000
10
19
525
0
0
1000
15
20
525
0
0
1000
30
21
525
0
0
1000
60
22
525
0
0
50
2
23
525
0
0
100
2
24
525
0
0
100
5
25
525
0
0
100
20
26
525
0
0
100
40
27
525
0
0
200
20
28
525
0
0
200
40
29
525
0
0
300
20
30
525
0
0
300
40
31
360
40
0
1000
5
32
360
40
0
1000
10
33
360
40
0
1000
15
34
360
40
0
1000
30
35
490
50
0
800
5
36
490
50
0
800
10
37
490
50
0
800
15
38
490
50
0
800
30
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