Equipement sur badgeuse BCM depuis le 02 mai 2021
Deep Si etching, SOI
Bosch process
Cryogenic process
Anti-notching apparatus
4" quartz clamp
220 mm electrode
ICP 5 kW @ 2 MHz
HF 600 W @ 13.56 MHz
LF 300 W @ 350 kHz, pulsed
SF6, C4F8, O2
SF6+O2
Continuous
SF6+C4F8
Additional gas: Ar