Picture of Si_DRIE_02
Current status:
WARNING
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Group:
CMNF Team
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Etching tool dedicated to Silicon only. No apparent metals allowed, no metal masks.

Etch stop layers allowed:

Si, SiO2, SiN, photoresists are the ONLY materials permitted as etch stop layers. 

Mask allowed:

Photoresist, SiO2, SiN are the ONLY permitted masks

Training is provided that includes 1- course given in IEMN amphitheater about plasma basics and intriduction to DRIE, 

2- practical training on the tool.

 

 

Tool name:
Si_DRIE_02
Manufacturer:
SPTS
Model:
CMNF(gra)CT_42

Bosch process with several recipes adapted to etch silicon from 1micron to 500microns

Instructors

Licensed Users

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