Etching tool dedicated to Silicon only. No apparent metals allowed, no metal masks.

Etch stop layers allowed:

Si, SiO2, SiN, photoresists are the ONLY materials permitted as etch stop layers. 

Mask allowed:

Photoresist, SiO2, SiN are the ONLY permitted masks

Training is provided that includes 1- course given in IEMN amphitheater about plasma basics and intriduction to DRIE, 

2- practical training on the tool.