• Wafer size from 1⁄4 to 4 inch and mask size: quartz 4*4 and 5*5
• Exposure mode: Proximity, soft, hard and vacuum contact
• Top side alignment (TSA) down to 0.5μm, bottom side alignment (BSA) down to 1 μm
• Resolution with vacuum contact down to 800 nm with resist Aznlof 2020
Equipement sous badgeuse BCM